Ulwazi lokumakishwa kweemveliso zehardware ikakhulu lubandakanya abalinganiswa abahlukeneyo, iinombolo zeseriyali, amanani emveliso, iibhakhowudi, iikhowudi ezinomacala amabini, imihla yemveliso, kunye neepateni zokuchongwa kwemveliso.Kwixesha elidlulileyo, ubukhulu becala sasisebenzisa ushicilelo, ukukrolwa koomatshini, iintlantsi zombane kunye nezinye iindlela zokulungisa.Khwela kuyo.Nangona kunjalo, ukusetyenziswa kwezi ndlela zokusetyenzwa kwemveli zokulungiswa kuya kubangela ukuba umphezulu wemveliso ye-hardware ucinezele ngomatshini ukuya kumlinganiselo othile, kwaye ngokunzulu ngakumbi, kunokubangela ukuba ulwazi lwelebhile liwe.
Ngokwandiswa kunye nokukhuthazwa kweteknoloji yokumakisha i-laser, oomatshini bokuphawula i-laser baziswa kwintsimi yangoku yokumakisha kwizicelo ezitsha, kwaye ixabiso lesicelo kwishishini le-hardware langoku liba libaluleke ngakumbi.Xa kuthelekiswa neendlela zokucutshungulwa kwemveli ezifana nokuprinta, ukubhala ngoomatshini, kunye nomatshini wokukhutshwa kombane, itekhnoloji yokumakisha i-laser ineenzuzo ezizodwa.Iimpawu zokusebenza koomatshini bokumakishwa kwelaser ziye zazisa izinto ezintsha kunye negumbi lophuhliso kwindlela yokumakisha yangoku.Ukumakishwa kweLaser kwahlukile kwindlela yokumakisha yemveli.Umatshini wokumakisha weLaser yindlela yokumakisha esebenzisa i-laser yoxinaniso lwamandla aphezulu ukuze usasazeke indawo yokusebenza ukuba ibe ngumphunga okanye ibangele ukusabela kweekhemikhali zokutshintsha kombala, ngaloo ndlela kushiya uphawu olusisigxina.Ineendleko zokugcina eziphantsi kunye nokuguquguquka okuphezulu., Ukuthembeka kunye nezinye iimpawu, inamathuba okusebenza okubanzi kwiinkalo ezineemfuno eziphezulu zokulula kunye nokulunga.
Ukucubungula ngeteknoloji ye-laser akucacile kwaye kuchanekile kuphela, kodwa kwakhona akunakucinywa okanye ukuguqulwa.Oku kuluncedo kakhulu kumgangatho wemveliso kunye nemijelo, kwaye kunokuthintela ngokufanelekileyo ukuthengiswa kwemveliso ephelelwe lixesha, ukuchasana ne-counterfeiting, kunye nokuthintela ukuthengiswa kwempahla.Ngaphezu koko, emva kokuba i-laser igxininisekile, i-laser encinci kakhulu inokusekwa.Kanye njengesixhobo, izinto zetsimbi kumphezulu wemveliso ye-hardware inokususwa kwinqanaba ngenqaku.Ububanzi bomgca obuncinci bunokufikelela kwi-0.04mm.Nokuba iimveliso zehardware ezincinci kakhulu zinokusebenzisa ukukhanya kwelaser.Unokufikelela kumakishwa acokisekileyo.Ngaphezu koko, yonke inkqubo yokucubungula ilawulwa yinkqubo yekhompyutheni yekhompyutheni, enokuthembeka okuphezulu kunye nokusebenza kakuhle.Iipateni eziphawulweyo kunye nolwazi lwemveliso kufuneka ludityaniswe kuphela yisoftware ukubuyisela ngokuchanekileyo ulwazi loyilo kwimveliso yehardware.
Ixesha lokuposa: May-24-2021